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Used Photo-patternable Adhesive as a key enabling material
November 1, 2013
By: DAVID SAVASTANO
Editor, Ink World Magazine
Imec announced that it has successfully used JSR’s innovative PA (Photo-patternable Adhesive) material for wafer-scale processing of lab-on-chip devices. With PA as a key enabling material, imec has processed microfluidic cell-sorter devices, merging microheaters and sensors with wafer-scale polymer microfluidics. PA is a breakthrough material: a good microfluidic channel material and adhesive at the same time, suitable for wafer-scale processes and mass production. Lab-on-chip technology wi...
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